Effects of creep and thermal drift on modulus measurement using depth-sensing indentation

In modulus measurement by depth-sensing indentation, previous considerations assume elastic recovery to be the sole process during unloading, but in reality creep and thermal drift may also occur, causing serious errors in the measured modulus. In this work, the problem of indentation on a linear vi...

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Journal Title: Journal of Materials Research Vol. 17; no. 3; pp. 660 - 668
Authors: Gang Feng, A. Ngan
Format: Article
Published: 2002