Modeling of the thermal effects of heat generating devices in close proximity on vertically oriented printed circuit boards for thermal management applications
The localized thermal interactions between adjacent devices on vertically orientated circuit boards in natural convection are predicted using experimentally validated computational fluid dynamics models. The effects of power density, device proximity, device geometry, circuit board material, board p...
|Journal Title:||International Journal of Thermal Sciences Vol. 46; no. 3; pp. 253 - 261|
|Authors:||Randy Weinstein, Jared Harvest, Amy Fleischer|