A Carbon Fiber, Air-Cooled Heat Exchanger for High Performance Electronic Cooling

Miniaturization, and the continued improvements in the speed and performance of electronics and other heat-dissipating systems, places and increasing demand on thermal management systems through the increase in power densities. There is a challenge to provide new thermal management technologies that...

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Authors: Gerard Jones, B.J. Sullivan
Conference Location: Hawaii Island, Hawaii
Conference Dates: March 16-20, 2003
Proceedings Title: 6th ASME-JSME Thermal Engineering Joint Conference (AJTEC-2003)
Format: Conference Proceeding
Published: New York, NY : American Society of Mechanical Engineers, 2003