A Carbon Fiber, Air-Cooled Heat Exchanger for High Performance Electronic Cooling
Miniaturization, and the continued improvements in the speed and performance of electronics and other heat-dissipating systems, places and increasing demand on thermal management systems through the increase in power densities. There is a challenge to provide new thermal management technologies that...
|Authors:||Gerard Jones, B.J. Sullivan|
|Conference Location:||Hawaii Island, Hawaii|
|Conference Dates:||March 16-20, 2003|
|Proceedings Title:||6th ASME-JSME Thermal Engineering Joint Conference (AJTEC-2003)|
New York, NY :
American Society of Mechanical Engineers,