Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board
Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures (60°C and 100°C above ambient) on single circuit boards (FR4 and copper clad FR4) are experimentally studied. The effect of heat source location on maximum power dissipation is presen...
|Journal Title:||Journal of Electronic Packaging Vol. 126; no. 1; pp. 14 - 21|
|Authors:||A.S. Feischer, K.A. Krug, Randy Weinstein|