The Use of Dialkyldithiocarbamate and Bis(acetylacetone)ethylenediimine Ligands for Copper Chelation in Supercritical Carbon Dioxide
Chemical-mechanical planarization (CMP) is a process of oxidizing and chelating the copper overburden present in an interconnect device while mechanically polishing the surface of the wafer. Because the use of condensed CO2 as the solvent for CMP would be environmentally and technically advantageous...
|Journal Title:||Industrial & Engineering Chemistry Research Vol. 45; no. 26; pp. 8779 - 8787|
|Authors:||C.A. Bessel, S.D. Thai, D.M. Omiatek, A. Dunbar, C.E. Kendrex, L.L. Grotzinger, G.E. Denison, J.M. DeSimeone, Walter J. Boyko, Randy Weinstein, Dorothy Skaf|