Steady state and transient comparison of perimeter and rowbased cooling employing controlled cooling curves
The perpetual increase of data processing has led to an ever increasing need for power and in turn to greater cooling challenges. High density (HD) IT loads have necessitated more aggressive and direct approaches of cooling as opposed to the legacy approach by the utilization of row-based cooling. I...
|Authors:||Alfonso Ortega, B. Sammakia, R. Tipton, H. A. Alissa, K. Nemati, D. King, M. Seymour|
|Conference Location:||San Francisco, CA|
|Conference Dates:||July 6-9, 2015|
|Proceedings Title:||ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels|