The effectiveness of data center overhead cooling in steady and transient scenarios Comparison of downward flow to a cold aisle versus upward flow from a hot aisle
The most common approach to air cooling of data centers involves the pressurization of the plenum beneath the raised floor and delivery of air flow to racks via perforated floor tiles. This cooling approach is thermodynamically inefficient due in large part to the pressure losses through the tiles....
|Authors:||Alfonso Ortega, L. Silva-Llanca, M. Del Valle|
|Conference Location:||San Francisco, CA|
|Conference Dates:||July 6-9, 2015|
|Proceedings Title:||ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels|